This system uses QCW fifiber laser as the light source. Various welding methods such as continuouswelding, quasi-continuous welding, and single-pulse point welding are realized by controlling the welding path with the galvanometer. The heat input is precisely controlled by editing the waveform and adjusting the duty cycle, so as to realize lap welding or butt welding of metal sheets, especially stainless steel, nickel, copper, etc.
This system uses CW fifiber laser and AOB adjustable beam mode laser as the light source. The galvanometer is used to control the welding path, and various welding paths such as spiral point welding, concentric point welding, s-shape fifilling welding, sinusoidal swing welding, and fifigure-8 swing welding are realized. By editing the waveform and adjusting the duty cycle to precisely control the heat input, it can achieve lap welding or butt welding of stainless steel, copper, aluminum, and nickel with a thickness of 0.05-8mm.
PCB Depaneling is suitable for cutting various types of PCB substrates, such as soft and hard bonding boards, FR4, PCB, FPC, fingerprint recognition modules, covering films, composite materials, copper substrates, aluminum substrates, etc，It can be equipped with ultraviolet or green laser according to needs, and the splitting process is clean and dust-free to avoid circuit failure caused by conductivity caused by waste materials. Help customers solve production efficiency and yield issues. Compatible with products with a maximum size of 460×460mm.
The Golden Gun-U LDS-HH-3000 is a high-speed ultrafast laser drilling system developed for precision blind and buried microvia processing in M9 Plus high-frequency and high-speed PCBs. Its cold-ablation process produces clean, low-carbonization hole walls with minimal heat-affected zones, helping preserve the low-loss dielectric properties and signal integrity of advanced PCB materials.
High yield and low cost, equipped with HiPA new generaon of laser control technology,high speed and high precision FPCB microvia drilling equipment. Can be used for all kindsof FPC process like: laser blind hole, through hole, cung, window opening, etc.
High yield and low cost, equipped with HiPA new generation of laser control technology, high speed and high precision LTCC microvia drilling equipment. Can be used for all kinds of LTCC process like: laser blind hole, through hole, cutting, etc.
HM110FFH is an automatic precision equipment designed for high-precision positioning andmarking of product information for micro-semiconductor wafer chips to meet the increasingmarket demand for chip-level packaging wafer production capacity. The unparalleled advantage ofthis device lies in its ultra-high-precision identification and positioning products and markingproducts. Using Scanvision technology to capture chip images, the positioning accuracy is less than15um, the marking line width is <10um, and it can achieve 50umx50um small character markingAnother major feature is high speed. The calculation of product positioning and marking position iscompleted through algorithms, and the precise positioning and marking of the marking positionare directly completed by the galvanometer, without the need for high-speed movement of the XYplatform. lt also supports customization of laser type, illumination method, optical pathconfiguration and software to ensure the best solution for customers.
Twin laser cutting station design, for high cutting speed and accuracy. Fully automated cutting, PNP, loading & unloading.