Laser Curing System

Product Description

The laser curing system uses a diode laser as the light source. After beam shaping, a uniform rectangular light spot is obtained, and the surface of the part is irradiated for uniform heating. The glue (low/medium/high temperature) is rapidly heated up to the curing temperature, and the liquid is changed to a solid state to achieve joining of the parts.

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Advantages

  1. Customizable spot shape and size meet the requirements of different curing areas;

  2. The uniformity of laser beam distribution is >95%;

  3. The laser beam switching results in higher efficiency;

  4. Both power and temperature control curing modes;

  5. Small thermal influence realizes precise curing of small areas and high yield rate;

  6. Strong laser penetration ability achieves deep or hidden glue curing at one tim;

  7. Stable performance, easy integration, in line with the development of automation and precision.

Specifications

Laser Source

Wavelength

Average Power

Fiber Length

Fiber Interface

Cooling Mode

Spot Shape

Diode Laser

915 / 976 / 1080nm

200-500W

5m (Customizable)

D80 / SMA905

Air-cooling

Rectangle, ring (Customizable)

Spot Size

Laser Uniformity

Beam Switching

Temperature Control Accuracy

Working Distance

XYZ-axis Stroke

Machine Dimension

1×1mm / 6×6mm / (Customizable)

≥90%

1-/2- Channel (Customizable)

±5℃

60-200mm

300×300×150mm

900×1000×1800mm

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Application
Effects

Consumer electronics, semiconductors, acoustics, communications, medical devices, etc.

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