The laser curing system uses a diode laser as the light source. After beam shaping, a uniform rectangular light spot is obtained, and the surface of the part is irradiated for uniform heating. The glue (low/medium/high temperature) is rapidly heated up to the curing temperature, and the liquid is changed to a solid state to achieve joining of the parts.
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Advantages
Customizable spot shape and size meet the requirements of different curing areas;
The uniformity of laser beam distribution is >95%;
The laser beam switching results in higher efficiency;
Both power and temperature control curing modes;
Small thermal influence realizes precise curing of small areas and high yield rate;
Strong laser penetration ability achieves deep or hidden glue curing at one tim;
Stable performance, easy integration, in line with the development of automation and precision.
Specifications
Laser Source | Wavelength | Average Power | Fiber Length | Fiber Interface | Cooling Mode | Spot Shape |
Diode Laser | 915 / 976 / 1080nm | 200-500W | 5m (Customizable) | D80 / SMA905 | Air-cooling | Rectangle, ring (Customizable) |
Spot Size | Laser Uniformity | Beam Switching | Temperature Control Accuracy | Working Distance | XYZ-axis Stroke | Machine Dimension |
1×1mm / 6×6mm / (Customizable) | ≥90% | 1-/2- Channel (Customizable) | ±5℃ | 60-200mm | 300×300×150mm | 900×1000×1800mm |
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Application
Effects
Consumer electronics, semiconductors, acoustics, communications, medical devices, etc.
