Ultrafast Laser Drilling Machine-Golden Gun-U
- High-Speed M9 PCB Drilling
- Clean and Precise Microvias
- eliable Signal Performance
The Golden Gun-U LDS-HH-3000 is a high-speed ultrafast laser drilling system developed for precision blind and buried microvia processing in M9 Plus high-frequency and high-speed PCBs. Its cold-ablation process produces clean, low-carbonization hole walls with minimal heat-affected zones, helping preserve the low-loss dielectric properties and signal integrity of advanced PCB materials.
Designed for scalable production, the system supports microvia diameters from 35 μm, full-panel positioning accuracy of ±20 μm, and drilling speeds of more than 400 holes per second. It is compatible with ceramic-filled and glass-fiber-reinforced M9 substrates, as well as PI, LCP and other dielectric materials used in PCB and FPC manufacturing.
Advantages
1. Deep Customization: Precision-tuned for M9 material, fully compatible with ceramic-filled and glass-fiber-reinforced substrates;
2. Superior Hole Wall: Carbonization-free cold ablation creates smooth, clean hole walls to boost reliability of subsequent copper plating;
3. Precision: Processes ≥35μm microvias with uniform vertical profiles and accurate taper control;
4. Uncompromised Material Performance : Minimal heat-affected zone retains M9’s inherent low-loss dielectric properties;
5. Quality & Efficiency Combined: Micron-level precision supports scalable mass production for steady, reliable output;
6. Wide Application: Besides M9 material, it is also compatible with PI, LCP and other dielectric substrates, and suits FPC applications;
7. Process Synergy: Seamlessly integrated into M9 PCB production workflows to ensure lifecycle-long product reliability.
Specifications
Model | Machine Size | Weight | Laser Type | Accuracy | Holes Diameter & circularity | High throughput |
LDS-HH-3000 | 5000 mm × 2220 mm × 1950 mm | 9800 kg | UV Laser | ±20 μm over full panel | > 35 μm; > 90 % | >400 holes/s |
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