Home > Product > OJ Microelectronics > FPC Cover Layer Laser Cutting Equipment
- High Quality
- High Efficiency
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Advantages
1. Marble gantry structure to achieve high rigidity and processing stability;
2. Optical splitting and light switching system to support the two sets of processing platforms working simultaneously. Compatible with a variety of material cutting;
3. Support single-axis processing. Can exchange to ultra-high power single-axis cutting machine to process thicker products;
4. Reserve the position of the loading and unloading interface Support reel to sheet and sheet by sheet;
5. High pressure dust collection device to reduce the dust generated during processing;
6. Automatic measurement of thickness of sampling material and correction of processing position;
7. JPT self-developed software which is easy to operate and can be changed at any time according to customer needs;
8. Equipped with processing log and fault log function to grasp the production dynamics easily.
Specifications
| Item | Spec | Item | Spec |
| Laser | UV-30 | Processing range | Dual platform 600×300mm |
| Laser power | 30W | Repeatability accuracy | ±1μm |
| Scope of scan head | 48×48mm | Positioning accuracy | ±3μm |
| Laser pulse frequency | 30-1000kHz | Overall machining accuracy | ±20μm |
| Cutting line width and band range | <30μm; 355nm | Depth control accuracy | ±30μm |
| Single – and dual-header switch function | Yes | Machine size | 1550×1350×1700mm |
| Compensate for expansion and contraction | Yes | Machine weight | 2000kg |
| Auto focus function | Yes | Loading and unloading method | Reel to sheet, sheet by sheet |
| Cutting jointed board function | Yes | Cutting efficiency | 1000-5000mm/s |
| Processing material | Cover layer, PET film, PP film, PI film… | Memory capacity | 1TB |
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