Automatic Cutting Machine

Product Description

IR picosecond laser is used to ensure perfect beam quality, fine spot and high cutting precision.

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Advantages

1. Compatible with a variety of domestic and overseas laser models. Optional customized CCD solution and other functional modules can be added;

2. High speed XY platform ensures stability under high speed processing;

3. Double work station for efficient cutting. Increase the processing range to realize the customized large-size laser cutting;

4. Realize no taper cutting, smooth edge and minimized chipping.

Specifications

UPH

Positioning Accuracy

Cutting Accuracy

Laser Apot

Laser Power

Chipping Size

Residuals Size

Machine Dimensions

Custom designed

<5μm

±5μm

Φ<10μm

20W/50W/80W/100W

<10μm

<10μm

3100×2500×1700mm

solutions

Application
Effects

Optical glass, strengthened glass, plain glass, ground glass, ultra-thin glass, sapphire, mobile phone panel, watch cover, vehicle panel, tablet computer panel, glass storage CD, TFT-LCD, silicon wafer and other brittle material filamentation and separation.

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