LTCC MicroVias Drilling System – Golden Gun-L

Product Description

High yield and low cost, equipped with HiPA new generation of laser control technology, high speed and high precision LTCC microvia drilling equipment. Can be used for all kinds of LTCC process like: laser blind hole, through hole, cutting, etc.


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1. Double Y platform to slice automatic loading and unloading, greatly improve efficiency;

2. Equipped with high power and high stability picosecond UV laser, stable power and small attenuation, to ensure the quality and efficiency of drilling;

3. Equipped with HiPA new generation of laser control technology, it can accurately control the laser index in the process of high-speed machining, and improve the quality and precision of drilling;

4. Independent research and development of professional drilling software, to achieve a variety of different ways of drilling, can be customized according to customer needs;

5. With energy real-time monitoring and accurate calibration compensation, the drilling stability is greatly guaranteed;

6. Visual monitoring system ensures drilling stability and yield;

7. Software compatible with various types of functions, the interface is simple and easy to operate, you can learn basic operations in a short time.


Laser TypeLaser PowerDrilling CapacityMaximum Processing RangeMachining AccuracyRepetitive Positioning AccuracyThe Processing ThicknessMachine Dimensions
UV Laser30W≥30μm252×252mm±20μm±1μm≤1.0mm2100×1700×1880mm



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