Automatic Laser etching machine for wafer-Overview

Product Description
  1. Automatic multi-station mode, double-side grooving at the same time, ultra-fast laser processing, to achieve high efficiency and income generation;
  2. Compatible with different sizes of silicon chip;
  3. Efficiently automatic alignment, customized operation interface and functions;
  4. High precision visual positioning and detection design effectively ensure the machining accuracy and test results;
  5. No pollution, zero consumables and environmental friendly.

Video

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Advantages

  1. Automatic loading/unloading from cassette;
  2. Vision system equipped for positioning process;
  3. Machine includes robot for product transportation. Two lasers, two work station and vision system enable precisely scribing on both face synchronously at high speed.

Specifications

Wavelength

Power

Wafer Size

Single Side Accuracy

Position Deviation for Both Sides

Beam Width

Z axis Travel

Power Supply

Air

Dimension

355nm

5W/10W

4 inch, 5 inch, 6 inch

±10μm

<20μm

>15μm

100mm

AC 220V, 50Hz

0.5MPa

1300 × 1200 × 1800mm

solutions

Application
Effects

Laser is applied to etch wafer surface with single side accuracy of 10μm, position deviation of 20μm for both sides.

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