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Product Description
Laser solder jetting welding uses a laser as a heat source. A single solder ball is transported to the nozzle through the solder ball conveying system, heated to a molten state by a laser beam in an inert gas atmosphere, sprayed to the surface of the welding workpiece, infiltrated and diffused to form a bonding layer, which results in a firm connection.
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Advantages
- Rapid droplet welding in an inert gas atmosphere, high ball mounting efficiency;
- Selective tin ball diameter to meet the welding requirements of samples of different specifications;
- No flux pollution, no solder residue, effectively ensure the lifespan of components;
- High-precision CCD positioning system, especially suitable for precise welding of tiny devices;
- Single and double station are available to effectively control production costs;
- High stability platform system, in line with the development of integration and automation.
Specifications
| Laser Source | Laser Wavelength | Average Power | Tin Ball Diameter | Ball Mounting Speed | Fiber Length |
| CW / QCW / Diode | 1064nm, 915/976nm | 200-300W / 75-300W / 100-300W | 0.2mm≤Φ≤1.8mm | 4-6pcs/s | 5m (Customizable) |
| Fiber Interface | Cooling Mode | Positioning Accuracy | XYZ-axis Stroke | Machine Dimension | |
| QCS / QBH / D80 | Air-cooling | ±5μm | 300×300×150mm | 900×1000×1800mm |
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Application
Effects
Consumer electronics, semiconductors, automotive electronics, acoustics, communications, medical devices, military, etc.








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