The TrimCore Pro Thin-film Laser Trimmer 2nd delivers high-speed, high-precision resistor trimming with accuracy up to ±0.01%. Supporting IR/GR/UV lasers and chip sizes from 01005 to 2512, it ensures kerf widths as fine as 7 μm. Equipped with intelligent monitoring, multiple trimming algorithms, and up to 192 channels, it provides smarter automation, faster throughput, and flawless quality for mass production.
The high-voltage tester is mainly used for short-term overload (STOL) test of high-quality and high-precision chip resistors. The resistance change before and after the high-voltage test is compared by the measurement system, and the bad resistors are screened out and cut through by laser to reduce the risk of resistance instability. Customers can edit the test conditions to meet the quality requirements of different specifications of resistors. It is an efficient high-voltage method with a screening function.
Single chip-resistor tester provides quick high precision testing and analysis automatically. Using high precision resistance meter with automatic control system. Single chip-resistor tester is ideally for inspection and testing of product.
The laser scriber is applied to the scribing of various types of chip resistor ceramic substrates, including infrared and ultraviolet models. The device uses a laser with customized model parameters emits an extremely fine laser beam at adequate energy density. The beam goes through an optical beam shaping process and is then expanded, filtered and focused before hitting the ceramic substrate. This vaporizes the part of the substrate that is hit by the beam, forming scribe lines on the surface.
Laser Trimmer is mainly used to scan and trim resistors with the short-pulse laser. The laser can “cut out” kerfs of given depth by gasifying the resistive film on the ceramic substrate, altering the length and the cross-sectional area of the resistor and this subsequently changes its resistance value.
Hybrid welding is to combine the fifiber laser and the diode laser into one laser beam through the optical lens group, which is output simultaneously and coaxial in space. The output energyof diode laser and fifiber laser can be adjusted independently, so hybrid welding has the advantages of both laser welding. It can not only achieve the deep penetration welding effffect of fifiber laser, but also have the advantages of diode laser, which is preheating, slow cooling and smooth welding seam.
The wavelength of diode blue laser is 450nm, which can be greatly absorbed by high-reflflection metal material, thus it can realize high-stability and high-quality welding of gold, silver, copper and their alloys. The blue laser has high beam quality and strong penetration ability. It can achieve penetration welding of 1.5mm copper, 2mm manganese copper, 2mm nickel-chromium alloy and so on. The maximum continuous laser power output of 1500W can achieve a welding speed of more than 200mm/s, which greatly improves the production capacity. It can be used in automotive parts, passive components, new energy power batteries, electronic components and other industries.
Laser solder jetting welding uses a laser as a heat source. A single solder ball is transported to the nozzle through the solder ball conveying system, heated to a molten state by a laser beam in an inert gas atmosphere, sprayed to the surface of the welding workpiece, infiltrated and diffused to form a bonding layer, which results in a firm connection.
The laser curing system uses a diode laser as the light source. After beam shaping, a uniform rectangular light spot is obtained, and the surface of the part is irradiated for uniform heating. The glue (low/medium/high temperature) is rapidly heated up to the curing temperature, and the liquid is changed to a solid state to achieve joining of the parts.
The solder paste laser welding system adopts an automatic solder paste placing device, and the solder paste is applied to the products to be welded. The solder paste and the workpiece are heated by the laser. And when the solder paste is melted, it wets the surface of the product, diffffuses and forms a bonding layer to achieve a stable connection.
This system uses CW fifiber laser and AOB adjustable beam mode laser as the light source. The galvanometer is used to control the welding path, and various welding paths such as spiral point welding, concentric point welding, s-shape fifilling welding, sinusoidal swing welding, and fifigure-8 swing welding are realized. By editing the waveform and adjusting the duty cycle to precisely control the heat input, it can achieve lap welding or butt welding of stainless steel, copper, aluminum, and nickel with a thickness of 0.05-8mm.
The laser system uses the dense pulse energy of a carbon dioxide laser to act on the black glue covered on the iron sheet, causing it to partially gasify and partially form larger dust particles that are sucked away with the vacuum, achieving the goal of laser glue removal. The laser system is also equipped with an independently developed AOI detection system, which can quickly and accurately determine the size and appearance of the area after glue removal.
By using an optimized ultra short laser pulse process, selectively remove the absorption layer, scratch the black electrode layer, do not damage the substrate, Efficient etching was performed on PEN-ITO.
Polarizer laser cutting manipulates laser beam to vaporize or melt the material at working area to cut the polarizer. Laser beam can be controlled by CNC to achieve automatic complicated trajectory cutting to get desired material shape.
This equipment is a five axis (machine tool)+3-axis (galvanometer) linkage laser precision machining system that combines specificity and universality. It has the functions of five axis large-scale precision positioning and local three-axis high-speed laser scanning linkage tracking. It is composed of a five axis motion system, laser and optical systems, CCD visual positioning and automatic focusing, and a system CNC system. It can meet the requirements of surface precision carving, material removal, machining of irregular holes, and manufacturing of high-end components for complex curved materials in the 3C industry. It can also be applied to civilian fields such as mold manufacturing, medical device processing, and nozzle punching, with fully independent intellectual property rights.
The Golden Gun-U LDS-HH-3000 is a high-speed ultrafast laser drilling system developed for precision blind and buried microvia processing in M9 Plus high-frequency and high-speed PCBs. Its cold-ablation process produces clean, low-carbonization hole walls with minimal heat-affected zones, helping preserve the low-loss dielectric properties and signal integrity of advanced PCB materials.
PCB Depaneling is suitable for cutting various types of PCB substrates, such as soft and hard bonding boards, FR4, PCB, FPC, fingerprint recognition modules, covering films, composite materials, copper substrates, aluminum substrates, etc，It can be equipped with ultraviolet or green laser according to needs, and the splitting process is clean and dust-free to avoid circuit failure caused by conductivity caused by waste materials. Help customers solve production efficiency and yield issues. Compatible with products with a maximum size of 460×460mm.
High yield and low cost, equipped with HiPA new generation of laser control technology, high speed and high precision LTCC microvia drilling equipment. Can be used for all kinds of LTCC process like: laser blind hole, through hole, cutting, etc.
JPT PCB UV marking machine is mainly used in PCB, FPCB, SMT and otherindustries. lt provides a complete set of integrated process traceabilitysolutions for PCB manufacturers, including complete functional modulessuch as code assignment, code reading, and data system. lt helps customersto realize the traceability and control of PCB production cycle, improveproduct quality and production capacity. Compatible with small-format andlarge-format PCB boards. lt also supports front and back marking, flippingand can realize professional laser processing and coding of QR codes, text,symbols and patterns.
HM110FFH is an automatic precision equipment designed for high-precision positioning andmarking of product information for micro-semiconductor wafer chips to meet the increasingmarket demand for chip-level packaging wafer production capacity. The unparalleled advantage ofthis device lies in its ultra-high-precision identification and positioning products and markingproducts. Using Scanvision technology to capture chip images, the positioning accuracy is less than15um, the marking line width is <10um, and it can achieve 50umx50um small character markingAnother major feature is high speed. The calculation of product positioning and marking position iscompleted through algorithms, and the precise positioning and marking of the marking positionare directly completed by the galvanometer, without the need for high-speed movement of the XYplatform. lt also supports customization of laser type, illumination method, optical pathconfiguration and software to ensure the best solution for customers.
HiPA Photonics Pte. Ltd. was established in 2010 and located in the confluent area of semiconductor industry companies in Singapore. HiPA is a high-tech company supported by the Singapore Economic Development Board.
Established in 2010
Cover 27 countries
