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Product Description
- Compatible with different sizes of silicon wafer；
- Efficient automatic alignment, customized operation interface and functions；
- Laser processing enables machining with no contact, no edge collapse, negligible heat damage and no water added；
- No pollution, zero consumables, environmental friendly；
- Less thickness of wafer favors laser etching method.
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Advantages
- Automatic loading/unloading from cassette；
- Vision system equipped for positioning process；
- θ axis rotation motor equipped for product positioning；
- PNP module inside takes product from cassette to carrier, vision capture before laser cutting. PNP returns the wafer after laser cutting is accomplished.
Specifications
Wavelength | Laser Power | Work Piece Size | Accuracy | Cutting Depth | Beam Width | X Axis Travel |
355nm | 15W/30W | 4 inch, 5 inch, 6 inch | ±10μm | >50μm | >20μm | 300mm |
Y Axis Travel | Z Axis Travel | θ Axis Travel | Power Supply | Air | Dimension | |
300mm | 100mm | 360º | AC 220V, 50Hz | 0.5MPa | 1560 × 1430 × 1800mm |
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