Automatic wafer cutting equipment

Product Description
  1. Compatible with different sizes of silicon wafer;
  2. Efficient automatic alignment, customized operation interface and functions;
  3. Laser processing enables machining with no contact, no edge collapse, negligible heat damage and no water added;
  4. No pollution, zero consumables, environmental friendly;
  5. Less thickness of wafer favors laser etching method.

Video

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Advantages

  1. Automatic loading/unloading from cassette;
  2. Vision system equipped for positioning process;
  3. θ axis rotation motor equipped for product positioning;
  4. PNP module inside takes product from cassette to carrier, vision capture before laser cutting. PNP returns the wafer after laser cutting is accomplished.

Specifications

Wavelength

Laser Power

Work Piece Size

Accuracy

Cutting Depth

Beam Width

X Axis Travel

355nm

15W/30W

4 inch, 5 inch, 6 inch

±10μm

>50μm

>20μm

300mm

Y Axis Travel

Z Axis Travel

θ Axis Travel

Power Supply

Air

Dimension

 

300mm

100mm

360º

AC 220V, 50Hz

0.5MPa

1560 × 1430 × 1800mm

 

solutions

Application
Effects

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