L3030 Laser Micro Processing System

Product Description

Utilizing high-energy light beams to illuminate the surface of PCB circuit boards, the vaporization cutting of PCB materials is achieved by controlling parameters such as beam energy density, frequency, speed, and processing times.Laser cutting/splitting machines used in the electronics industry can be used for fine cutting and splitting of products such as hard boards, soft boards, and covering films.

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Advantages

  1. The incision interface has no discoloration or protrusion; Vertical cutting without chamfering;
  2. After cutting, it is easier to split the board, and UV cutting has low smoke and dust;
  3. Comprehensive cutting accuracy ± 30um, CCD positioning accuracy<5um;
  4. Compatible with multiple FPC substrates; Quick switching between different products; Efficient software supports multiple languages;
  5. No obvious mechanical or thermal stress. Even sensitive substrates can be accurately processed;
  6. Single camera positioning, achieving recognition of overall feature points and mark points on the substrate.

Specifications

Laser

Wavelength

Average Power

Positioning Accuracy

Repeat Positioning Accuracy

Effective Processing Range

Cutting Materials

Cutting Light Spot

Machine Power

ns , ps – Customer requires customization

355nm

10-30w

<±5μm

<±1.5μm

300×300mm

Laser cutting of materials such as FPC reinforcement board, PCB hard board, PI film, LCP, etc

Minimum 12μm

<4kw

solutionS

Application
Effects

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