Laser Micro Hole Processing System

Product Description

Automated laser drilling, automatically completing micro hole forming. It can program the hole shape, and the self-developed software can freely edit the graphic trajectory and aperture.

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Advantages

  1. Independently developed MOPA and CW lasers, with continuous and pulse modes available, with an average maximum power of up to 350W;
  2. High pulse frequency (1-4MHz), wide pulse width range (2-2000ns), and independently adjustable frequency and pulse width;
  3. The trajectory can be edited, compatible with the needs of products of different sizes ;
  4. Cutting trajectory reverse compensation technology can compensate for high-speed trajectory deviation online and improve cutting accuracy;
  5. The visual system and XYZ motion axis can achieve precise product alignment ;           
  6. Specially designed coaxial positive pressure blowing slag removal system to ensure consistent cutting quality;
  7. Smooth inner wall, few burning areas, fast drilling speed, and automated clamping of incoming materials.

Specifications

Laser

Wavelength

Average Power

Positioning Accuracy

Repeat Positioning Accuracy

Minimum Machining Aperture

Cutting Materials

Cutting Light Spot

Machine Power

Fiber Laser

1064nm

150-2000w

<±5μm

<±1.5μm

50μm

All metals such as iron, copper, aluminum, titanium, etc.

Minimum12μm

<5kw

solutions

Application
Effects

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