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Passive Component Product Line

Passive component product line focus on passive component resistance, capacitance, sensory segmentation, and dig deep into industry pain points, to provide customers with overall solutions for core equipment and materials. At the same time, this product line will fully integrate the resources of all process suppliers and customers of resistance-capacitance sensory segmentation, to accelerate the localization process of passive components industry with customers.

Deeply cultivate the subdivision field of passive components.

Understanding customer needs and pain points.

Has a senior R & D technical team.

Has a completely independent core technology.

The high-voltage tester is mainly used for short-term overload (STOL) test of high-quality and high-precision chip resistors. The resistance change before and after the high-voltage test is compared by the measurement system, and the bad resistors are screened out and cut through by laser to reduce the risk of resistance instability. Customers can edit the test conditions to meet the quality requirements of different specifications of resistors. It is an efficient high-voltage method with a screening function.

Single chip-resistor tester provides quick high precision testing and analysis automatically. Using high precision resistance meter with automatic control system. Single chip-resistor tester is ideally for inspection and testing of product.

The laser scriber is applied to the scribing of various types of chip resistor ceramic substrates, including infrared and ultraviolet models. The device uses a laser with customized model parameters emits an extremely fine laser beam at adequate energy density. The beam goes through an optical beam shaping process and is then expanded, filtered and focused before hitting the ceramic substrate. This vaporizes the part of the substrate that is hit by the beam, forming scribe lines on the surface.

Laser Trimmer is mainly used to scan and trim resistors with the short-pulse laser. The laser can “cut out” kerfs of given depth by gasifying the resistive film on the ceramic substrate, altering the length and the cross-sectional area of the resistor and this subsequently changes its resistance value.